| File Note: |
It is submitted that the industry was visited on 30.12.2025 and during visit it was observed that the industry is engaged in manufacturing of lead frames having semi conductor chips.
Hence, the project proponent is required to apply in the category 163.4 (Semiconductor Assembly, Testing, Marking and Packaging Facility (ATMP) )
In view of above, the application of the industry may be returned please with request to resubmit the application in the category 163.4 (Semiconductor Assembly, Testing, Marking and Packaging Facility (ATMP) ) |
